Nano aluminum nitride belongs to the category of diamond-like nitrides, appearing as a white solid powder with a melting point of 2400°C and a boiling point of 2517°C. Nano aluminum nitride can remain stable in a vacuum up to 1500°C and only begins to oxidize in air at 1000°C. It reacts almost not at all with concentrated inorganic acids and has good water resistance. Nano aluminum nitride has a wide range of applications in fields such as electronic device heat dissipation, thermal conductive materials, high-temperature structural materials, ceramic devices, and polymer-based composites. Its excellent physical and chemical properties enable it to perform outstandingly in these areas.
Nano silicon nitride appears as a white solid powder, with a melting point of 1900°C (under pressure). Its thermal conductivity is 16.7 W/(m·K), and it has a low density, only 2/5 that of steel. The hardness of nano silicon nitride reaches above 9, and its compressive strength typically exceeds 1 GPa. Due to its high hardness and dense structure, it has excellent wear resistance, extending the product's lifespan.
Nano boron nitride (chemical formula: HBN) appears as a white solid powder, with a melting point of 2700°C and a density of 2.29 g/cm³. It is insoluble in cold water and slightly soluble in hot acid. Nano boron nitride possesses high insulation, high thermal conductivity, and high hardness, making it widely applicable in many fields.
Zirconium phosphate is a new type of functional mesoporous material developed in recent years.
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