Jinghuang Technology was invited to attend the 2025 High-End Grinding and Polishing Materials Technology Conference


Release time:

2025-04-16

The "2025 High-End Grinding and Polishing Materials Technology Conference," hosted by the China Powder Network, opened grandly in Zhengzhou, Henan on April 16, 2025. Jinghuang Technology, as a representative innovative enterprise in the field of nano-powder materials, was invited to attend the conference. They engaged in in-depth exchanges surrounding the cutting-edge technologies, industry trends, and innovative applications of polishing materials, showcasing Jinghuang's core competitiveness and strategic layout in the high-end grinding and polishing field.

         On April 16, 2025, the "2025 High-End Grinding and Polishing Materials Technology Conference," hosted by the China Powder Network, was grandly opened in Zhengzhou, Henan. Jinghuang Technology, as a representative of innovative enterprises in the field of nano-powder materials, was invited to attend the conference. They engaged in in-depth exchanges on the cutting-edge technologies, industry trends, and innovative applications of polishing materials, showcasing Jinghuang's core competitiveness and strategic layout in the high-end grinding and polishing field.

This conference, themed "Promoting Innovation in Grinding and Polishing Material Technology and Contributing to the High-Quality Development of High-End Manufacturing," brought together experts, scholars, and corporate representatives from the semiconductor, new energy, and aerospace industries. The main contents of the conference are as follows:

1. Current Status, Applications, and Demand of Polishing Material Industry

2. Preparation and Application Status of Alumina, Silicon Carbide, Silica, and Rare Earth Polishing Abrasives

3. Current Status of CMP and Other Polishing Technology Applications

4. Application of Polishing Materials and Technologies in Semiconductor Wafers, Substrates, and Other Semiconductor Fields

5. Application of Superhard Materials such as Silicon Carbide, Boron Nitride, and Diamond in Grinding and Polishing

6. Preparation and Application of Polishing Liquids and Their Additives (Deionized Water, Abrasive Oxidants, Dispersants, pH Adjusters)

7. Current Status of Nanometer Polishing Abrasive Technology

8. Current Status of Preparation and Application of Important Consumables such as Polishing Pads

9. Application of Grinding and Polishing Materials and Technologies in the Processing of Precision Components for High-End Equipment

Jinghuang Technology's R&D team, combining its technological advantages, conducted in-depth exchanges on the theme of "Preparation of Alumina, Silica, and Rare Earth Polishing Abrasives," and showcased the company's latest achievements in nano-polishing abrasives and high-end grinding materials. With the rapid development of strategic emerging industries such as semiconductors and new energy vehicles, the company will continue to cultivate the field of precision processing materials and contribute "Jinghuang Power" to the independent innovation of high-end equipment manufacturing and the integrated circuit industry.

 

Key words: