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Nano Aluminum Nitride

Nano aluminum nitride belongs to the category of diamond-like nitrides, appearing as a white solid powder with a melting point of 2400°C and a boiling point of 2517°C. Nano aluminum nitride can remain stable in a vacuum up to 1500°C and only begins to oxidize in air at 1000°C. It reacts almost not at all with concentrated inorganic acids and has good water resistance. Nano aluminum nitride has a wide range of applications in fields such as electronic device heat dissipation, thermal conductive materials, high-temperature structural materials, ceramic devices, and polymer-based composites. Its excellent physical and chemical properties enable it to perform outstandingly in these areas.
  • Commodity name： Nano Aluminum Nitride

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Nitride series

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sales1@jinghuangnm.com

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  • Product Description

  • Product Features:

    Nano aluminum nitride (chemical formula: AlN) belongs to diamond-like nitrides, appearing as a white solid powder, with a melting point of 2400℃ and a boiling point of 2517℃. Nano aluminum nitride can remain stable in a vacuum up to 1500℃, and it only oxidizes in air at 1000℃, showing almost no reaction with concentrated inorganic acids and good water resistance. Nano aluminum nitride has a wide range of applications in electronic device heat dissipation, thermal conductive materials, high-temperature structural materials, ceramic devices, and polymer-based composites, with its excellent physical and chemical properties making it perform outstandingly in these fields.

    Product Parameters:

    Popular Models

    JH-303

    Appearance

    White Powder

    Purity

    ≥99%

    Particle Size

    ≤25μm
    More model parameters vary (customization supported), please contact customer service for detailed parameters.

    Application Industries:

    1. Nano aluminum nitride has high thermal conductivity, which can quickly dissipate the heat generated by electronic devices, keeping the operating temperature of the equipment within a stable range, thereby improving the stability and service life of the equipment. In the semiconductor industry, the thermal conductivity of aluminum nitride ceramics can reach over 170 W/m·K, far exceeding traditional ceramic materials such as alumina, making it important for high-power electronic devices.

    2. The application of nano aluminum nitride in thermal conductive materials is also very extensive. It can be used to prepare thermal conductive silicone, thermal conductive epoxy resin, and thermal conductive plastics, which have good thermal conductivity and electrical insulation, suitable for heat transfer media in electronic devices, improving work efficiency. 3. Nano aluminum nitride has excellent high-temperature stability and mechanical properties, widely used in the preparation of high-temperature structural materials in aerospace, automotive engines, and gas turbines. For example, aluminum nitride ceramics can remain stable at high temperatures of 2200℃, making them ideal crucible materials.

    4. In the manufacturing of ceramic devices, nano aluminum nitride is used to produce integrated circuit substrates, electronic devices, and heat sinks. Its excellent thermal conductivity, electrical insulation, and low dielectric constant make it an ideal material for large-scale integrated circuit production.

    5. Nano aluminum nitride has good compatibility with polymer materials and is an excellent additive for polymer materials in electronic products. It can enhance the mechanical properties and thermal dielectric performance of composite materials, widely used in the preparation of polymer-based composites.

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